BRIEF-Holitech Technology Gets Regulatory Approval To Issue Bonds Worth Up To 1 Bln Yuan
Sept 4- Holitech Technology Co Ltd:.
Sept 4 (Reuters) – Holitech Technology Co Ltd:
* SAYS IT GETS SECURITIES REGULATOR’S APPROVAL TO ISSUEBONDSWORTH UP TO 1.0 BILLION YUAN ($146.24 million)Source text in Chinese: https://bit.ly/3jKSDttFurther company coverage:($1 = 6.8380 Chinese yuan renminbi)(Reporting by Hong Kong newsroom)